ADESSO ADVANCED MATERIALS ANNOUNCES NATURE PORTFOLIO PUBLICATION DETAILING BREAKTHROUGH RECYCLABLE COPPER CLAD LAMINATE TECHNOLOGY FOR GREEN ELECTRONICS WITH INDUSTRY GIANTS SYTECH AND LENOVO
CRANBURY, NJ — August 21, 2026 — Adesso Advanced Materials, a global pioneer in sustainable macromolecular chemistry, highlighted the peer-reviewed publication of its revolutionary recyclable Copper Clad Laminate (CCL) technology in Communications Chemistry, a prestigious journal within the Nature Portfolio.
The landmark paper—titled "Recyclable glass fiber-reinforced epoxy copper clad laminates for printed circuit board"—is officially featured in Volume 9 (2026) of the journal following its publication on June 26, 2026. The study details a major material science milestone: the development of high-performance, fully degradable thermoset substrates designed to eliminate electronic waste (e-waste) from the global printed circuit board (PCB) supply chain without compromising operational performance.
Copper Clad Laminates (CCLs) serve as the foundational structural material for nearly all modern electronics. However, because conventional CCLs rely on permanently cross-linked epoxy resins, end-of-life electronics have historically been impossible to recycle efficiently. Research published by Adesso Advanced Materials introduces a paradigm shift through the use of proprietary, cleavable polymer networks. Under mild chemical conditions, this cross-linked matrix degrades, allowing manufacturers to reclaim and reuse premium metallic and non-metallic components within the printed circuit board (PCB) industry.
"Having our work peer-reviewed and published in Volume 9 of Communications Chemistry is a powerful validation of Adesso's scientific foundations," said Dr. Bo Liang, Co-Founder & Chairman of Adesso Advanced Materials. "By proving that reliable copper clad laminates can be completely disassembled and recycled chemically under mild conditions, we are providing the electronics industry with a viable, scalable path toward true circularity and green manufacturing."
The commercial realization of this technology relies heavily on close cross-industry collaboration spanning from material suppliers to consumer device manufacturers. As a primary co-development partner and a premier global producer of printed circuit board substrates, SYTECH provided critical recyclable CCL development and manufacturing validation for the technology.
"Validating a recyclable substrate that meets rigorous industry specifications while seamlessly integrating into existing mass-production workflows has been a monumental achievement," said Mr. Zhongqiang Yang, Tech Expert at SYTECH. "Adesso’s resin chemistry allows us to offer our partners a truly circular substrate that satisfies stringent electrical, thermal, and moisture resistance requirements. This technology directly supports our corporate commitment to delivering eco-friendly, next-generation laminates to the global marketplace."
From the end-user consumer hardware perspective, Lenovo, a global technology powerhouse, views this material science breakthrough as a vital mechanism for achieving widespread electronics circularity and e-waste reduction across global hardware supply chains.
"E-waste represents one of the fastest-growing environmental challenges facing the technology sector, and solving it requires innovation at the fundamental molecular level," said Mr. Calvin Zhou at Lenovo. "Adesso's breakthrough in fully degradable copper clad laminates opens up unprecedented possibilities for hardware design. Implementing these smart polymer matrices into high-volume consumer hardware lines will allow device OEMs to completely rethink a product's lifecycle—enabling us to recapture precious raw components cleanly and move closer to an absolute zero-waste manufacturing loop."
Following this high-impact publication, Adesso is accelerating its pilot-scale validation programs and actively expanding strategic partnerships with major electronic hardware OEMs, semiconductor designers, and tier-one substrate manufacturers to commercialize recyclable electronic matrices globally.
The full peer-reviewed study can be accessed online via Communications Chemistry (2026, Vol. 9) at the official Nature Portfolio Portal. For more information please visit the Adesso Advanced Materials Official Platform.
About Adesso Advanced Materials
Adesso Advanced Materials is a leading-edge green chemistry company dedicated to inventing and scaling re-workable, degradable polymer matrices. With corporate and technical operations based out of Cranbury, New Jersey, Adesso develops proprietary Cleavamine curing agents and smart Recycloset formulation systems that replace legacy, non-recyclable materials across the electronics, automotive, wind power, and aerospace industries.
艾达索高新材料宣布在《自然》旗下期刊发表突破性成果：联合行业巨头生益科技与联想集团，推出用于绿色电子的环保可回收覆铜板技术
美国新泽西州克兰伯里 — 2026年8月21日 — 全球可持续高分子化学领域的先驱艾达索高新材料（Adesso Advanced Materials）宣布，其革命性的可回收覆铜板（CCL）技术研究成果已在《自然》（Nature）旗下著名期刊《通讯-化学》（Communications Chemistry）上公开发表。
这篇题为《用于印刷电路板的可回收玻璃纤维增强环氧树脂覆铜板》（"Recyclable glass fiber-reinforced epoxy copper clad laminates for printed circuit board"）的里程碑式论文，在2026年6月26日线上发表刊登于该期刊的第9卷（2026年）。该研究详述了材料科学领域的一项重大突破：成功研发出高性能、完全可降解的热固性基材，旨在不牺牲运行性能的前提下，从源头消除全球印刷电路板（PCB）供应链中的电子垃圾（e-waste）问题。
覆铜板（CCL）是几乎所有现代电子产品的基石结构材料。然而，由于传统的覆铜板依赖于永久交联的环氧树脂，报废的电子产品历来极难实现高效回收。艾达索高新材料发表的研究通过使用其核心专利——可化学降解聚合物网络，带来了颠覆性的范式转变。在温和的化学条件下，这种交联基体可以发生降解，从而使制造商能够回收并重新利用印刷电路板（PCB）工业中的优质金属和非金属树脂成分。
“我们的研究工作能够通过同行评议并发表在《通讯-化学》第9卷上，是对艾达索科研实力的强力背书，”艾达索高新材料创始人/董事长梁波博士表示，“通过证实可靠的覆铜板可以在温和条件下完全拆解并通过化学手段回收，我们正在为电子行业提供一条切实可行、可扩展的道路，以实现真正的循环经济和绿色制造。”
该技术的商业化落地极大地依赖于从材料供应商到消费电子设备制造商的紧密跨行业协作。作为核心共同开发伙伴以及全球领先的印刷电路板基材生产商，生益科技（SYTECH）为该技术提供了关键的可回收覆铜板（CCL）开发和量产工艺验证。
“成功验证一种既能满足严苛行业技术规范、又能无缝融入现有大规模生产流程的可回收基材，是一项具有里程碑意义的成就，”生益科技技术专家杨中强先生表示，“艾达索的树脂化学技术使我们能够为合作伙伴提供真正循环的基材，同时满足在电学、热学和耐湿性方面的严格要求。这项技术直接助力了我们向全球市场交付环保型、下一代层压板的企业承诺。”
从终端消费硬件的角度来看，全球科技巨头联想集团（Lenovo）将这一材料科学的突破视为在全球硬件供应链中实现广泛的电子产品循环和减少电子垃圾的关键机制。
“电子垃圾是科技领域面临的增长最快的环境挑战之一，解决这一问题需要从最基础的分子层面进行创新，”联想集团的周艳平先生（Calvin Zhou）表示，“艾达索在完全可降解覆铜板领域的突破为硬件设计开辟了前所未有的可能性。将这些智能聚合物基体引入大批量消费硬件产线中，将允许原始设备制造商（OEM）彻底重新思考产品的生命周期——使我们能够干净地重新捕获珍贵的原材料组件，并进一步迈向绝对的零废弃制造闭环。”
随着这一高影响力学术成果的发表，艾达索目前正在加速其试点规模的验证项目，并积极扩大与主要电子硬件OEM、半导体设计商以及一线基材制造商的战略合作伙伴关系，以在全球范围内推动可回收电子基体的商业化进程。
欲了解同行评议研究的完整内容，可直接访问《自然》旗下期刊 《通讯-化学》（2026年第9卷） 官方门户网站。获取更多信息，请访问艾达索高新材料官方平台。
关于艾达索高新材料
艾达索高新材料（Adesso Advanced Materials）是一家前沿的绿色化学公司，致力于研发和规模化量产可重工、可降解的聚合物基体。公司总部及技术运营中心位于美国新泽西州克兰伯里。艾达索开发的核心专利Cleavamine可降解固化剂和Recycloset 配方系统，正在逐步开发取代电子、汽车、风力发电和航空航天工业中传统的、不可回收的传统材料。